LYCHIP Chip Technical White Paper

I. Product Overview

1. Core Positioning

LYCHIP is a next-generation heterogeneous fused intelligent processor designed for edge computing and AIoT scenarios. It adopts an advanced "sensing-computing integration" architecture, achieving high integration of perception, computation, and decision-making.

2. Technical Codename

• Internal Codename: Lingxiao
• Architecture Generation: NeoFusion 2.0
• Process Node: 6nm FinFET Plus

II. Core Architectural Innovations

1. Triple-Engine Heterogeneous Architecture

text

┌─────────────────────────────────────┐
│      LYCHIP Architecture Diagram     │
├───────────┬───────────┬───────────┤
│  AI Engine │  DSP Cluster  │  RISC-V   │
│ (4×NPU)   │ (8-core)  │ (Dual-core)│
├───────────┴───────────┴───────────┤
│   Smart Interconnect Fabric        │
├─────────────────────────────────────┤
│Perception│ Memory   │ Security    │
│Interface │Controller│ Engine      │
└─────────────────────────────────────┘

2. Key Module Specifications

(1) Neural Processing Unit (NPU) Cluster

• Configuration: 4 independent NPUs supporting dynamic power allocation
• Peak Performance: 16 TOPS (INT8) / 4 TFLOPS (FP16)
• Power Efficiency: 5 TOPS/W (industry-leading)
• Special Features:Dynamic Precision ScalingSparse computation acceleration (supports 50% sparsity)Multi-model parallel execution pipeline

(2) Digital Signal Processing (DSP) Cluster

• Core Count: 8 configurable DSP cores
• Frequency Range: 800MHz-2.0GHz dynamic scaling
• Dedicated Accelerators:Image Signal Processor (ISP): Supports 4K@60fps real-time processingAudio Processing Unit: Supports 8-channel microphone arraysVideo Encoder: H.265/H.264 4K encoding

(3) RISC-V Control Cores

• Architecture: Dual-core RISC-V 64-bit
• Instruction Set Extension: Custom AI Instruction Extension (AIX)
• Real-time Capability: µs-level interrupt response, supports deterministic computing

III. Technical Specifications

1. Performance Parameter Table

2. Interfaces & Connectivity

• High-Speed Interfaces:PCIe 4.0 ×4USB 3.2 Gen22×10GbE Ethernet
• Video Interfaces:Supports 4×4K display outputsHDMI 2.1, DP 1.4a
• Perception Interfaces:12-channel MIPI CSI-28-channel I2S audio input

IV. Software Ecosystem & Development Support

1. Software Development Kit (SDK)

• LYCHIP Studio: Integrated development environment
• Model Conversion Tool: Supports ONNX/TensorFlow/PyTorch to LYIR conversion
• Performance Profiler: Real-time power and performance monitoring
• Simulation Toolchain: Complete virtual development environment

2. Framework Support

text

├── Training Frameworks
│   ├── TensorFlow 2.x
│   ├── PyTorch 1.9+
│   └── MindSpore
├── Inference Frameworks
│   ├── Tengine-LY
│   ├── TensorRT-Lite
│   └── ONNX Runtime
└── Operating Systems
    ├── Linux 5.10+
    ├── RT-Thread
    └── LY-OS (Real-time OS)

3. Pre-trained Model Library

• Computer Vision: 30+ pre-optimized models
• Natural Language Processing: Optimized BERT, GPT-2
• Speech Processing: End-to-end speech recognition models
• Recommendation Systems: Personalized recommendation acceleration engine

V. Application Scenario Solutions

1. Intelligent Security & Surveillance

• Solution Features:16-channel 1080p video real-time analysisConcurrent face/license plate/behavior recognitionLocal privacy-preserving computation

2. Industrial Visual Inspection

• Performance Metrics:Detection speed: <5ms per imageDefect recognition accuracy: >99.5%Supports mixed-product line inspection

3. Autonomous Driving Assistance

• Functional Features:Multi-sensor fusion processingReal-time obstacle detection and trackingASIL-D functional safety level

4. Intelligent Robotics

• Integrated Solution:SLAM accelerationMulti-modal interaction processingReal-time path planning

VI. Security & Reliability

1. Hardware Security Architecture

• Physical Security:Anti-tamper packagingSide-channel attack protection
• Data Security:Hardware encryption engine (AES-256/SM4)Secure boot and trusted execution environment
• Functional Safety:ISO 26262 ASIL-D compliantDual-core lockstep mechanism

2. Reliability Metrics

• Operating Temperature: -40℃ ~ 125℃
• Mean Time Between Failures: >100,000 hours
• ESD Protection: >8kV HBM

VII. Mass Production & Supply

1. Product Models

2. Development Boards & Evaluation Kits

• LY-DEVKIT-A: Basic development kit
• LY-EDGEBOX: Edge computing reference design
• LY-AIVISION: Machine vision development platform

VIII. Technology Roadmap

2024-2025 Plan

• LYCHIP Pro: 3nm process, performance up to 64 TOPS
• Optical Computing Integration: Silicon photonics computing unit R&D
• Quantum Algorithm Acceleration: Quantum-classical hybrid computing architecture

Summary

LYCHIP chip, as a next-generation intelligent processor, offers these core advantages:

1. Leading Architecture: Sensing-computing integration architecture eliminates data movement bottlenecks
2. Excellent Power Efficiency: Industry-leading 5 TOPS/W power efficiency
3. Complete Ecosystem: Comprehensive software toolchain and rich pre-trained models
4. Secure & Reliable: Full-link security design meets stringent application requirements
5. Broad Application Coverage: Suitable for multiple domains from consumer electronics to industrial control

LYCHIP will continue to advance edge intelligence development, providing a powerful computational foundation for the era of ubiquitous connectivity.

LYCHIP芯片技术白皮书

一、产品概述

1. 核心定位

LYCHIP是新一代异构融合智能处理器，专为边缘计算与AIoT场景设计，采用先进的"感算一体"架构，实现感知、计算与决策的高度集成。

2. 技术代号

• 内部代号：凌霄
• 架构代际：NeoFusion 2.0
• 工艺制程：6nm FinFET Plus

二、核心架构创新

1. 三引擎异构架构

text

┌─────────────────────────────────────┐
│           LYCHIP架构示意图           │
├───────────┬───────────┬───────────┤
│  AI引擎   │  DSP集群  │  RISC-V   │
│ (4×NPU)   │ (8核心)   │ (双核)    │
├───────────┴───────────┴───────────┤
│     智能互连总线(SmartFabric)      │
├─────────────────────────────────────┤
│ 感知接口 │ 存储控制器 │ 安全引擎  │
└─────────────────────────────────────┘

2. 关键模块说明

(1) 神经处理单元(NPU)集群

• 算力配置：4个独立NPU，支持动态功耗分配
• 峰值算力：16 TOPS (INT8) / 4 TFLOPS (FP16)
• 能效比：5 TOPS/W (业内领先水平)
• 特色功能：动态精度自适应(Dynamic Precision Scaling)稀疏计算加速(支持50%稀疏度)多模型并行执行(Multi-Model Pipeline)

(2) 数字信号处理(DSP)集群

• 核心数量：8个可配置DSP核心
• 频率范围：800MHz-2.0GHz动态调节
• 专用加速器：图像信号处理器(ISP)：支持4K@60fps实时处理音频处理单元：支持8通道麦克风阵列视频编码器：H.265/H.264 4K编码

(3) RISC-V控制核心

• 架构：双核RISC-V 64位
• 扩展指令集：定制AI指令扩展(AIX)
• 实时性：µs级中断响应，支持确定性计算

三、技术规格参数

1. 性能参数表

2. 接口与连接性

• 高速接口：PCIe 4.0 ×4USB 3.2 Gen22×10GbE以太网
• 视频接口：支持4路4K显示输出HDMI 2.1, DP 1.4a
• 感知接口：12通道MIPI CSI-28通道I2S音频输入

四、软件生态与开发支持

1. 软件开发套件(SDK)

• LYCHIP Studio：一体化开发环境
• 模型转换工具：支持ONNX/TensorFlow/PyTorch到LYIR转换
• 性能分析器：实时功耗与性能监控
• 仿真工具链：完整的虚拟开发环境

2. 框架支持

text

├── 训练框架
│   ├── TensorFlow 2.x
│   ├── PyTorch 1.9+
│   └── MindSpore
├── 推理框架
│   ├── Tengine-LY
│   ├── TensorRT-Lite
│   └── ONNX Runtime
└── 操作系统
    ├── Linux 5.10+
    ├── RT-Thread
    └── LY-OS (实时操作系统)

3. 预训练模型库

• 计算机视觉：30+预优化模型
• 自然语言处理：BERT、GPT-2优化版
• 语音处理：端到端语音识别模型
• 推荐系统：个性化推荐加速引擎

五、应用场景解决方案

1. 智能安防与监控

• 方案特点：16路1080p视频实时分析人脸/车牌/行为识别并发处理本地隐私保护计算

2. 工业视觉检测

• 性能指标：检测速度：<5ms/图像缺陷识别准确率：>99.5%支持多品类产品混线检测

3. 自动驾驶辅助

• 功能特性：多传感器融合处理实时障碍物检测与跟踪ASIL-D功能安全等级

4. 智能机器人

• 集成方案：同步定位与建图(SLAM)加速多模态交互处理实时路径规划

六、安全与可靠性

1. 硬件安全架构

• 物理安全：防物理攻击封装侧信道攻击防护
• 数据安全：硬件加密引擎(AES-256/SM4)安全启动与可信执行环境
• 功能安全：支持ISO 26262 ASIL-D双核锁步机制

2. 可靠性指标

• 工作温度：-40℃ ~ 125℃
• 平均无故障时间：>100,000小时
• ESD防护：>8kV HBM

七、量产与供应

1. 产品型号

2. 开发板与评估套件

• LY-DEVKIT-A：基础开发套件
• LY-EDGEBOX：边缘计算参考设计
• LY-AIVISION：机器视觉开发平台

八、技术路线图

2024-2025规划

• LYCHIP Pro：3nm工艺，算力提升至64 TOPS
• 光计算集成：硅光计算单元预研
• 量子算法加速：量子-经典混合计算架构

总结

LYCHIP芯片作为新一代智能处理器，具备以下核心优势：

1. 架构领先：感算一体架构，消除数据搬运瓶颈
2. 能效卓越：5 TOPS/W的行业领先能效比
3. 生态完善：完整的软件工具链和丰富的预训练模型
4. 安全可靠：全链路安全设计，满足严苛应用要求
5. 场景覆盖广：从消费电子到工业控制的多领域适用性

LYCHIP将持续推动边缘智能的发展，为万物互联时代提供强大的算力基石。